| TFYY33 | Microchip fabrication, 4,5 ECTS-points /Mikrochipstillverkning/ Advancement level: D | |
| Aim: This is an engineering course for those who want to get more knowledge about the microfabrication technique of chips and other devices. The course will essentially cover four domains, i.e., starting materials, process flow steps, process integration and simulations, and chip packaging and modules, for microchip production. The main body of the course is Si-based technology. To provide a general overview, however, special technology issues for processing devices based on other materials will also be addressed.Prerequisites: The courses TFFY 34 Semiconductor Technology and TFYY 39 Solid State Electronics are desirable, but not compulsory. Course organization: The course is composed of three parts: lectures, laborations, and a visit to an industrial fab. Course language is English.Course content: General Introduction; Starting materials (Crystal growth and wafer preparation, epi-layer growth, and Si on insulator (SOI) technology); Process step flow (Material manipulation using ion implantation and diffusion, rapid thermal process, micropattern transfer, thin film technology and multiple-layer interconnects, and Process technologies for compound semiconductor devices); Process integration and process simulation for bipolar and CMOS technology; Chip production (Packaging and chip modules, reliability, and fab construction); Summary and out look of future development.Course literature: The Science and Engineering of Microelectronic Fabrication, Stephen A. Campbell (Oxford University Press, New York, 1996). | ||
| TEN1 | , 2 p. | |
| LAB1 | , 1 p. | |